Doplňujúce informácie | Thermal silicone compound (grease) for heatsinks, Vynikající tepelná impedance, Helps the heat dissipation from a CPU, chipset or processor to a heatsink, Poskytuje stabilitu, dokonale se sloučí, nedelaminuje, neoxiduje, Nevede elektrický proud, Net weight | 15 g (23 g in the bottle), DImensions | 30 (diameter) x 35 mm, Farba | sivá, Thermal conductivity | > 4.63 W / mK, Thermal Impedance <0.0087 ° C-in2 / W, Dielectric Strength | 2.5 KV/mm, Density | > 3.15 g/ cm3 , The dielectric constant | > 2.4, Viscosity | 12500 Pa s |